Flexible “fiber chip”: integrating high-density integrated circuits into an elastic polymer fiber
Fields of Study & Subjects
Advanced Sensor and Energy Harvesting Materials
Nanomaterials and Printing Technologies
Semiconductor Lasers and Optical Devices
Publication details
- Journal / source
- Science China Materials
- Volume
- 69
- Issue
- 9
- Pages
- 5918–5919
- Publication date
- 6 March 2026
- Language
- EN