Junction temperature evaluation method for IGBT modules based on half-bridge commutation effects

Journal of Power Electronics 2026

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Authors: Mingxing Du, Guosheng Hong, Jianxiong Yang
DOI: 10.1007/s43236-025-01262-4
Cited by: 1
References: 27

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies HVDC Systems and Fault Protection Thermal Analysis in Power Transmission

Publication details

Journal / source
Journal of Power Electronics
Publisher
Springer Science and Business Media LLC
Publication date
26 February 2026
Language
EN