Overcoming thermal-spatial constraints in server power supplies: immersion-cooled 54 V modular design achieving threefold power density enhancement and titanium class efficiency

Journal of Power Electronics 2026

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Authors: Liwen Guo, Jing Liu, Liang Chen, Guolong Li, Wenfei Zhou, Jianxiao Zou

DOI: 10.1007/s43236-025-01263-3

Cited by: 0

References: 24

Fields of Study & Subjects

Advanced DC-DC Converters Heat Transfer and Optimization Advanced Power Amplifier Design

References 24