High-thermal-conductivity integrated EWOD chip for ultra-fast, low-cost pathogen detection

Analytica Chimica Acta 2026

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Authors: Fangzhou Zhang, Kun Wang, Xiaoqiang Shu, Danfeng Su, Yongjie Yu, Chang Chen, Jianlong Zhao, Shilun Feng, Bo Liu

DOI: 10.1016/j.aca.2026.345227

Cited by: 2

References: 33

Fields of Study & Subjects

3D IC and TSV technologies Neuroscience and Neural Engineering Nanomaterials and Printing Technologies

References 33