Sulfur migration in silver: Insights from first-principles static and dynamic simulations
Fields of Study & Subjects
Copper Interconnects and Reliability
Electrocatalysts for Energy Conversion
Semiconductor materials and devices
Publication details
- Journal / source
- Acta Materialia
- Volume
- 314
- Pages
- 122330–122330
- Publication date
- 12 May 2026
- Language
- EN