Achieving strong interface bonding in CuAl/Fe bimetal laminated composites via tailoring an ordered large-scale interlocking structure

Acta Materialia 2026

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Authors: Bo Peng, Bowen Dong, Zhaoliang Meng, Tongzheng Xin, Zhubin He, Jiehua Li, T F Li, Jinchuan Jie

DOI: 10.1016/j.actamat.2026.122434

Cited by: 4

References: 61

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Intermetallics and Advanced Alloy Properties Aluminum Alloys Composites Properties

References 61