A novel bonding mechanism capitalizing on the dual role of oxide in cold-spraying Cu onto Al

Additive manufacturing 2026

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Authors: Haijun Zhang, Rui Yang, Ye Tian, Yi Liu, Hua Li, Jun Song

DOI: 10.1016/j.addma.2026.105184

Cited by: 1

References: 66

Fields of Study & Subjects

High-Temperature Coating Behaviors Copper Interconnects and Reliability Intermetallics and Advanced Alloy Properties

References 66