A novel flexible clamping method with adaptive error compensation for enhancing precision in polymer injection molding
Abstract
Injection-molded optical products are widely used in various fields, but the clamping errors of traditional injection molding clamping systems are particularly detrimental to the manufacture of high-precision optical devices. Herein, a flexible adaptive clamping method was developed to dynamically compensate for clamping error through the isostatic pressure-driven floating structure. The adaptive clamping characteristics, specifically the relationship between the floating angle and the clamping force, were investigated through both theoretical modeling and laser interferometry experiments. And the feasibility and performance of this system were conclusively validated by successfully molding polystyrene (PS) microlens arrays. The produced components exhibited exceptional weight repeatability, with a deviation of merely 0.614‰, meeting the requirements for precision injection molding, and optical testing confirmed uniform focusing and imaging performance. This self-adaptive clamping method provides a practical and robust solution for high-precision injection molded products, overcoming mold deflection caused by clamping system errors to adapt the mold precision. The novel adaptive flexible clamping system can autonomously compensate for mold clamping deviations caused by geometric errors and stress deformation in real time through a unique isostatic pressure-driven floating mechanism. And the polystyrene microlens array successfully fabricated using this system exhibits a weight repeatability deviation of only 0.614‰ and demonstrates uniform focusing and imaging performance. • A novel flexible clamping system with self-adaptive error compensation. • Self-adaptive clamping mechanism compensating errors gains unveiled. • Achieves 0.614‰ weight repeatability in optical product molding.
Fields of Study & Subjects
Injection Molding Process and Properties
Semiconductor Lasers and Optical Devices
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Advanced Industrial and Engineering Polymer Research
- Volume
- 9
- Issue
- 2
- Pages
- 385–398
- Publication date
- 7 January 2026
- Language
- EN