Experimental characterization of thermal grease degradation between warped mating surfaces in power-cycled assemblies
Fields of Study & Subjects
Thermal properties of materials
Electronic Packaging and Soldering Technologies
Adhesion
Friction
and Surface Interactions
Publication details
- Journal / source
- Applied Thermal Engineering
- Publisher
- Elsevier BV
- Volume
- 289
- Pages
- 129742–129742
- Publication date
- 12 January 2026
- Language
- EN