Leveraging band bending in SnS/SnSe type-I heterojunction for high thermoelectric performance and on-chip hotspot cooling

Applied Thermal Engineering 2026

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Authors: Yixuan Liu, Lifu Yan, Shangchao Lin
DOI: 10.1016/j.applthermaleng.2026.130042
Cited by: 2
References: 64

Fields of Study & Subjects

Advanced Thermoelectric Materials and Devices 2D Materials and Applications Heusler alloys: electronic and magnetic properties

Publication details

Journal / source
Applied Thermal Engineering
Publisher
Elsevier BV
Volume
290
Pages
130042–130042
Publication date
4 February 2026
Language
EN