Thermal management of electronic equipment utilizing heat pipes. A gateway review
Fields of Study & Subjects
Heat Transfer and Boiling Studies
Heat Transfer and Optimization
Thermal properties of materials
Publication details
- Journal / source
- Applied Thermal Engineering
- Publisher
- Elsevier BV
- Volume
- 291
- Pages
- 130098–130098
- Publication date
- 10 February 2026
- Language
- EN