Advanced thermal management scheme enhancing heat dissipation of line-replaceable modules

Applied Thermal Engineering 2026

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Authors: Junxiang Wang, Shubin Yin, Daitian Chen, Xingyu Zheng, Hongming Li, Wei Ji, Shiwei Zhang, Yong Tang, Wenzheng Guo, Zhiqiang Miao
DOI: 10.1016/j.applthermaleng.2026.130481
Cited by: 2
References: 13

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Thermal Analysis in Power Transmission Thermal properties of materials

Publication details

Journal / source
Applied Thermal Engineering
Publisher
Elsevier BV
Volume
293
Pages
130481–130481
Publication date
5 March 2026
Language
EN