Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling

Applied Thermal Engineering 2026

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Authors: Sangram Kumar Samal, Pang-Chieh Yu, Hsien-Chun Chang, Yogesh Fulpagare, Ian Winfield, Michael Matthews, Himanshu Pokharna, Chi-Chuan Wang
DOI: 10.1016/j.applthermaleng.2026.130683
Cited by: 2
References: 40

Fields of Study & Subjects

Heat Transfer and Optimization Heat Transfer and Boiling Studies Phase Change Materials Research

Publication details

Journal / source
Applied Thermal Engineering
Publisher
Elsevier BV
Volume
295
Pages
130683–130683
Publication date
21 March 2026
Language
EN