Design and experimental investigation of a three-dimensional topology-optimized heat sink for IGBT unit cooling

Applied Thermal Engineering 2026

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Authors: Hongyang Song, Dingbiao Wang, Chongrui Yang, Haoran Zhang, Guanghui Wang, Sa Xiang, 杨卫铁, Talib Dbouk

DOI: 10.1016/j.applthermaleng.2026.131382

Cited by: 3

References: 38

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Heat Transfer and Optimization Induction Heating and Inverter Technology

References 38