Bridging passive and active cooling: A review of geometric design strategies for hybrid electronic packaging systems

Applied Thermal Engineering 2026

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Authors: Mugyeom Jung, Hoonhee Jang, Hongyun So
DOI: 10.1016/j.applthermaleng.2026.131766
Cited by: 1
References: 158

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Advanced Materials and Mechanics

Publication details

Journal / source
Applied Thermal Engineering
Publisher
Elsevier BV
Volume
302
Pages
131766–131766
Publication date
6 June 2026
Language
EN