Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink

Applied Thermal Engineering 2026 Open access

Read full text
Authors: Heungdong Kwon, Roman Giglio, Daeyoung Kong, Muhammad Shattique, Hyoungsoon Lee, James W. Palko, Ercan M. Dede, Mehdi Asheghi, Kenneth E. Goodson
DOI: 10.1016/j.applthermaleng.2026.131914
Cited by: 0
References: 23

Fields of Study & Subjects

Heat Transfer and Optimization Thermal Radiation and Cooling Technologies Heat Transfer and Boiling Studies

Publication details

Journal / source
Applied Thermal Engineering
Publisher
Elsevier BV
Volume
303
Pages
131914–131914
Publication date
19 June 2026
Language
EN