Embedded microchannel enabling efficient thermoelectric cooler for high-heat-flux hotspot

Applied Thermal Engineering 2026

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Authors: Yifan Lei, Yuqing Wei, Daniyaer Yasen, Hangtian Zhu, Yanmei Kong, Xin Qian, X D Liu, Ronggui Yang
DOI: 10.1016/j.applthermaleng.2026.132221
Cited by: 1
References: 46

Fields of Study & Subjects

Advanced Thermoelectric Materials and Devices Heat Transfer and Boiling Studies Heat Transfer and Optimization

Publication details

Journal / source
Applied Thermal Engineering
Publisher
Elsevier BV
Volume
303
Pages
132221–132221
Publication date
3 July 2026
Language
EN