Wetting-induced porosity gradient formation in Cu nanoparticle sintering bonding

Applied Surface Science 2026

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Authors: Rongbao Du, Guisheng Zou, Shuaiqi Wang, Chengjie Du, C. Y. Huang, Jinpeng Huo, Lei Liu

DOI: 10.1016/j.apsusc.2026.165823

Cited by: 2

References: 34

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability Nanomaterials and Printing Technologies

References 34