Atomic mechanisms of Cu–Cu low-temperature bonding dominated by plastic deformation

Applied Surface Science 2026

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Authors: Jinhu Fan, Jinkun Wang, Huai Zheng, Liyi Li, Yiying Zhu

DOI: 10.1016/j.apsusc.2026.165904

Cited by: 2

References: 49

Fields of Study & Subjects

Microstructure and mechanical properties Advanced Welding Techniques Analysis Copper Interconnects and Reliability

References 49