A green, inhibitor-free CMP slurry enabled by synergistic surfactant design for cobalt-based copper interconnects

Applied Surface Science 2026

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Authors: Jiahui Li, Chao He, Xinhuan Niu, Jiakai Zhou, Changxin Dong, Xinjie Li, Zheng Wu, Bin Hu

DOI: 10.1016/j.apsusc.2026.165909

Cited by: 3

References: 35

Fields of Study & Subjects

Advanced Surface Polishing Techniques Copper Interconnects and Reliability Nanoporous metals and alloys

References 35