Unraveling the defect-free blind via filling mechanism in PCBs by a dual-functional monocomponent additive: in situ molecular spectroscopy and DFT validation

Applied Surface Science 2026

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Authors: Tianmin Wang, Hang Zhang, Bowen Chang, Mengdi Wang, Minggui Li, Minggui Li, Xixun Shen, Qunjie Xu, Qiaoxia Li

DOI: 10.1016/j.apsusc.2026.166100

Cited by: 2

References: 78

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Recycling and Waste Management Techniques Electronic Packaging and Soldering Technologies

References 78