Overcoming Ce–O–Si bonding: A pre-cleaning strategy for removing ceria particles on wafer surface after chemical mechanical polishing

Applied Surface Science 2026

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Authors: Lifei Zhang, Mei Yan, X Lu

DOI: 10.1016/j.apsusc.2026.166112

Cited by: 3

References: 50

Fields of Study & Subjects

Advanced Surface Polishing Techniques Fluid Dynamics and Thin Films Minerals Flotation and Separation Techniques

References 50