Selective control on material removal rate in chemical mechanical polishing of Cu/borosilicate glass using through-glass via technology

Applied Surface Science 2026

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Authors: Jongyeong Jeon, Chaerin Park, Seunghwan Lee, Gunhyoung Kim, Yechan Kim, Yechan Kim, Yechan Kim, Hyeonjeong Lee, Juyeol Lee, Hyunkyu Kim, Hyunkyu Kim, Juyeol Lee
+1 more Taesung Kim
DOI: 10.1016/j.apsusc.2026.166354
Cited by: 2
References: 53

Fields of Study & Subjects

Advanced Surface Polishing Techniques 3D IC and TSV technologies Copper Interconnects and Reliability

Publication details

Journal / source
Applied Surface Science
Publisher
Elsevier BV
Volume
730
Pages
166354–166354
Publication date
16 February 2026
Language
EN