Interface engineering of Cu foil–prepreg systems by controlling silane terminal groups and wettability

Applied Surface Science 2026 Open access

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Authors: Jin Young Kim, Woongsik Jang, Jihyun Lim, Young‐In Lee, Dong Hwan Wang

DOI: 10.1016/j.apsusc.2026.166566

Cited by: 0

References: 31

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

References 31