Structural characterization and bonding energy analysis for plasma-activated bonding of SiCN films: A reactive molecular dynamics study

Applied Surface Science 2026

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Authors: Juheon Kim, Minki Jang, Won Hong Choi, Junhyeok Park, Byungjo Kim, SJ Kim, Hayoung Chung

DOI: 10.1016/j.apsusc.2026.166598

Cited by: 2

References: 57

Fields of Study & Subjects

3D IC and TSV technologies Advanced ceramic materials synthesis Metal and Thin Film Mechanics

References 57