Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu

Applied Surface Science 2026

View at publisher

Authors: Ziting Ye, Shichen Xie, Yuanxing Duan, Xingchao Mao, Zishan Xiong, Fuxin Du, Qiyuan He, Yingxia Liu

DOI: 10.1016/j.apsusc.2026.166605

Cited by: 0

References: 35

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

References 35