Adhesion-layer-free Cu integration on glass and TaN via nitrogen-mediated interfacial engineering

Applied Surface Science 2026

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Authors: Jungheum Yun, Jong‐Seong Bae, Sang‐Geul Lee, Seung Min Yu, Seung Zeon Han, G H Lee

DOI: 10.1016/j.apsusc.2026.167311

Cited by: 1

References: 60

Fields of Study & Subjects

Copper Interconnects and Reliability 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

References 60