Stagnation point flow analysis in an inductively coupled plasma reactor for advanced deposition techniques
Fields of Study & Subjects
Plasma Diagnostics and Applications
Copper Interconnects and Reliability
Metal and Thin Film Mechanics
Publication details
- Journal / source
- Chemical Engineering Journal
- Publisher
- Elsevier BV
- Volume
- 529
- Pages
- 172713–172713
- Publication date
- 13 January 2026
- Language
- EN