Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging

Chemical Engineering Journal 2026

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Authors: Junjie Cheng, Wenpeng Duan, Qiguang Liu, Chang Juan Jing, Zhenfeng Zhu, Jue Cheng, Jiahao Ma, Junying Zhang

DOI: 10.1016/j.cej.2026.174268

Cited by: 8

References: 47

Fields of Study & Subjects

Synthesis and properties of polymers Epoxy Resin Curing Processes Polymer composites and self-healing

References 47