Electrospun nanofibrous film co-loaded with thymol/thiabendazole hydroxypropyl-β-cyclodextrin inclusion complexes: humidity-triggered release and edible fungi preservation application

Chemical Engineering Journal 2026

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Authors: Xinran Yin, Dan Zhu, Xinyan Zhang, Ruiwen Cheng, Haonan Ren, Yanan Sun, Demei Meng, Weina Li, Fansheng Cheng

DOI: 10.1016/j.cej.2026.177229

Cited by: 1

References: 44

Fields of Study & Subjects

Electrospun Nanofibers in Biomedical Applications Nanocomposite Films for Food Packaging Advanced Cellulose Research Studies

References 44