CuO-doped borosilicate glass fluxes for dense, low-resistivity copper films
Fields of Study & Subjects
Microwave Dielectric Ceramics Synthesis
Electrical and Thermal Properties of Materials
3D IC and TSV technologies
Publication details
- Journal / source
- Ceramics International
- Publisher
- Elsevier BV
- Volume
- 52
- Issue
- 8
- Pages
- 9710–9718
- Publication date
- 16 January 2026
- Language
- EN