A vitrified bond diamond grinding wheel prepared by DLP and grinding performance on single crystal silicon wafer
Fields of Study & Subjects
Advanced Surface Polishing Techniques
Advanced machining processes and optimization
Tunneling and Rock Mechanics
Publication details
- Journal / source
- Ceramics International
- Publisher
- Elsevier BV
- Volume
- 52
- Issue
- 8
- Pages
- 9776–9788
- Publication date
- 17 January 2026
- Language
- EN