Three-step electrochemical shear thickening polishing for damage-free processing of 4H-SiC wafers

Ceramics International 2026

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Authors: Mengmeng Shen, Yiwei Liang, Yi Ma, Min Wei, Yufei Fu, Mengqing Liu, Yuheng Wang, Hongyu Chen, Binghai Lyu, Wei Hang
DOI: 10.1016/j.ceramint.2026.01.212
Cited by: 5
References: 28

Fields of Study & Subjects

Advanced Surface Polishing Techniques Advanced machining processes and optimization Diamond and Carbon-based Materials Research

Publication details

Journal / source
Ceramics International
Publisher
Elsevier BV
Volume
52
Issue
8
Pages
10374–10384
Publication date
21 January 2026
Language
EN