Low thermal expansion and high thermal conductivity in epoxy molding compounds achieved via a dual-strategy of negative thermal expansion Cu2V2O7 and conductive fillers

Ceramics International 2026

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Authors: Yiping Lv, Feiyu Qin, Jijuan Wu, Xin Jin, Xiaoya Bai, Jun Sun, Xiangdong Ding, Lei Hu

DOI: 10.1016/j.ceramint.2026.02.265

Cited by: 1

References: 48

Fields of Study & Subjects

Thermal Expansion and Ionic Conductivity Thermal properties of materials High-pressure geophysics and materials

References 48