Active metal brazing of Cu/Si3N4/Cu dissimilar joint using a novel surface hydrogenated Ti foil

Ceramics International 2026

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Authors: Yuxin Zhang, Yong Xiao, Ruxia Liu, Yatong Lei, Dan Luo

DOI: 10.1016/j.ceramint.2026.03.220

Cited by: 2

References: 41

Fields of Study & Subjects

Copper Interconnects and Reliability Electrodeposition and Electroless Coatings 3D IC and TSV technologies

References 41