Enhancement of thermoelectric performance and mechanical reliability in electrodeposited chitosan nanofiber-bismuth telluride nanocomposite
Abstract
Thermoelectric generators (TEGs) offer a promising route for converting waste heat into electrical energy; however, the practical implementation of high-performance micro-TEGs (μTEGs) is limited by the material performance and mechanical fragility of thick bismuth telluride (Bi 2 Te 3 ) films. Although thick thermoelectric layers are required to sustain sufficient temperature gradients, conventional fabrication often induces residual stress, leading to cracking and structural failure. In this work, we introduce a sustainable synthesis strategy by incorporating bio-derived chitosan nanofibers (ChNFs) into the electrodeposition process. The amino and hydroxyl functional groups of ChNFs promote interfacial bonding and nucleation, enabling the rapid growth of dense, crack-free composite films with thicknesses up to 1000 μm. The introduction of ChNFs also creates abundant phonon-scattering interfaces, significantly reducing lattice thermal conductivity from 1.48 to 0.29 W m −1 K −1 and resulting in a 303% increase in the room-temperature figure of merit (ZT), from 0.12 to 0.50. At an optimal loading of 0.0123 wt%, the composite films exhibit a 15% increase in hardness while maintaining structural integrity. These results demonstrate a multifunctional materials design strategy that simultaneously enhances thermoelectric performance, mechanical robustness, and fabrication scalability. The ChNF–Bi 2 Te 3 nanocomposites provide a viable green pathway for developing reliable thick films for next-generation self-powered electronics and compact waste-heat harvesting systems.
Fields of Study & Subjects
Advanced Thermoelectric Materials and Devices
Thermal properties of materials
Thermal Expansion and Ionic Conductivity
Publication details
- Journal / source
- Ceramics International
- Publisher
- Elsevier BV
- Volume
- 52
- Issue
- 18
- Pages
- 34169–34179
- Publication date
- 30 May 2026
- Language
- EN