Multiscale modeling of area-selective atomic layer deposition of SiO2 on Al2O3 and SiO2 surfaces with intermediate etching steps
Fields of Study & Subjects
Semiconductor materials and devices
Copper Interconnects and Reliability
Advancements in Photolithography Techniques
Publication details
- Journal / source
- Chemical Engineering Science
- Publisher
- Elsevier BV
- Volume
- 325
- Pages
- 123422–123422
- Publication date
- 28 January 2026
- Language
- EN