Modelling and simulation of selective Si3N4 etching in 3D NAND structures
Fields of Study & Subjects
Semiconductor materials and devices
Plasma Diagnostics and Applications
3D IC and TSV technologies
Publication details
- Journal / source
- Chemical Engineering Science
- Volume
- 325
- Pages
- 123473–123473
- Publication date
- 28 January 2026
- Language
- EN