MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks

CIRP journal of manufacturing science and technology 2026

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Authors: Yu-Wei Chen, Jia-Fan Kuo, Yi-Chen Wang, Chung-Wei Cheng

DOI: 10.1016/j.cirpj.2026.01.012

Cited by: 8

References: 14

Fields of Study & Subjects

Laser Material Processing Techniques Advanced Surface Polishing Techniques Silicon Carbide Semiconductor Technologies

References 14