A grinding force modeling considering the laser-assisted micro-grooved surface in grinding silicon nitride ceramics

This study addresses the persistent challenges of microscopic damage in laser processing and the high grinding resistance coupled with low material removal rates in the machining of silicon nitride ceramics. To overcome these limitations, a novel laser-assisted grinding process is proposed, leveraging a comprehensive investigation into the effects of laser ablation on material properties, grinding forces, and material removal mechanisms. Central to this research is the innovative development of a grinding force model grounded in indentation fracture mechanics, which uniquely integrates the evolution of fracture toughness under laser thermal energy deposition. This model not only provides a theoretical foundation for understanding the material behavior during grinding but also demonstrates its practical feasibility through rigorous experimental validation. The study further elucidates the material removal process of silicon nitride ceramics, with a particular focus on the formation of microgrooves and the alteration of crack propagation directions near these microgrooves during brittle fracture. Quantitative analysis of material damage depth reveals that the introduction of microgrooves significantly reduces damage in adjacent regions, highlighting the effectiveness of the proposed approach. The findings underscore the innovation and practical applicability of the proposed model, offering a transformative solution for advanced ceramic machining.