Robust heat-free curing via ‘SiNergy’ in action: Residual cure kinetics and thermal stability of epoxy Silicon Nitride / Tungsten Carbide dual filler nanocomposites

Composites Communications 2026

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Authors: Gopal Krishna Bhagavatula, Snaha Leena, Krishna Prasad Rajan, Selvin P. Thomas, Rasana Nanoth, Alessandro Pegoretti, Jayanarayanan Karingamanna
DOI: 10.1016/j.coco.2026.102735
Cited by: 2
References: 44

Fields of Study & Subjects

Epoxy Resin Curing Processes Polymer Nanocomposites and Properties Synthesis and properties of polymers

Publication details

Journal / source
Composites Communications
Publisher
Elsevier BV
Volume
62
Pages
102735–102735
Publication date
27 January 2026
Language
EN