Enhancing mechanical properties and electrical conductivity of Cu-Ti-Si alloys through tailored thermomechanical processing

Composites Communications 2026

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Authors: Chen Guosheng, Cailiu Yin, Xinjiang Zhang, chengcheng Peng, Zhengwei Liu, Huan Chen, Chunqiang Yi, Wenbo Zhu
DOI: 10.1016/j.coco.2026.102738
Cited by: 0
References: 31

Fields of Study & Subjects

Metallurgical and Alloy Processes Microstructure and mechanical properties Aluminum Alloy Microstructure Properties

Publication details

Journal / source
Composites Communications
Volume
62
Pages
102738–102738
Publication date
30 January 2026
Language
EN