Aging process of epoxy resin-based conductive composite in flexible termination multilayer ceramic capacitors

Colloids and Surfaces A Physicochemical and Engineering Aspects 2026

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Authors: Qin Xu, Qingwen Huang, Linlin Du, Yifei Shan, Xuechao Du, Kun Yang, Liaoliang Ke
DOI: 10.1016/j.colsurfa.2026.139605
Cited by: 0
References: 18

Fields of Study & Subjects

Epoxy Resin Curing Processes Electronic Packaging and Soldering Technologies Dielectric materials and actuators

Publication details

Journal / source
Colloids and Surfaces A Physicochemical and Engineering Aspects
Volume
736
Pages
139605–139605
Publication date
16 January 2026
Language
EN