Particle removal behavior of composite surfactants during the post-CMP cleaning process for Co-patterned wafers

Colloids and Surfaces A Physicochemical and Engineering Aspects 2026

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Authors: Lifei Zhang, Mei Yan, Ke Wang, Xinchun Lu
DOI: 10.1016/j.colsurfa.2026.139748
Cited by: 1
References: 40

Fields of Study & Subjects

Advanced Surface Polishing Techniques Copper Interconnects and Reliability Silicon and Solar Cell Technologies

Publication details

Journal / source
Colloids and Surfaces A Physicochemical and Engineering Aspects
Publisher
Elsevier BV
Volume
737
Pages
139748–139748
Publication date
28 January 2026
Language
EN