Polyimide composites with optimized low dielectric constant and high thermal conductivity for electronic packaging

Composites Part A Applied Science and Manufacturing 2026

View at publisher
Authors: Yuxuan Zhang, Ying Han, Xinglong Cui, Hongyan Xia
DOI: 10.1016/j.compositesa.2026.109623
Cited by: 2
References: 56

Fields of Study & Subjects

Dielectric materials and actuators Thermal properties of materials Synthesis and properties of polymers

Publication details

Journal / source
Composites Part A Applied Science and Manufacturing
Publisher
Elsevier BV
Volume
204
Pages
109623–109623
Publication date
3 February 2026
Language
EN