Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates

Composites Part A Applied Science and Manufacturing 2026

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Authors: Sanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Jinwoong Kim, Chan Hyuk Park, Hak‐Sung Kim

DOI: 10.1016/j.compositesa.2026.110151

Cited by: 1

References: 47

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Textile materials and evaluations Epoxy Resin Curing Processes

References 47