Thermally resistant structural adhesive based on a phenolic resin/PEEK/SiO2 composite system, offering a balanced combination of strength, toughness, and thermal stability

Composites Part B Engineering 2026

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Authors: Laiming Song, Huagang Lv, Haoyu Yin, Dafeng Wang, Dafeng Wang, Sheng Li, Jinmei He, Wenxin Cao, Chao Wang, Jiaqi Zhu

DOI: 10.1016/j.compositesb.2026.113568

Cited by: 2

References: 24

Fields of Study & Subjects

Thermal properties of materials Gas Dynamics and Kinetic Theory Epoxy Resin Curing Processes

References 24