Structural optimization of ultrasonic welded thermoplastic microfluidic chips for enhanced sealing performance

Composites Part B Engineering 2026

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Authors: Ziqian Lu, Jiayu Yang, Yuan Qian, Qianyao Lin, Zhuolun Li, Juntian Zeng, Dongxu Zhang

DOI: 10.1016/j.compositesb.2026.113676

Cited by: 1

References: 10

Fields of Study & Subjects

3D IC and TSV technologies 3D Printing in Biomedical Research Epoxy Resin Curing Processes

References 10