Solvent-free phenolic oligomers with low viscosity and high char yield for resin transfer molding-processed composites

Composites Science and Technology 2026

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Authors: Peiqi Yang, Haitao Luo, Jiaxin Liu, Hongxiang Cai, Jiawang Wang, Zhe Su, Yi Luo, Chun Wei, Bo Niu, Donghui Long

DOI: 10.1016/j.compscitech.2026.111643

Cited by: 3

References: 51

Fields of Study & Subjects

Epoxy Resin Curing Processes Synthesis and properties of polymers Polymer Science and Applications

References 51