Effects of Cu content and Ga addition on suppressing intergranular corrosion of copper substrate in stainless steel/copper vacuum brazed joints

Corrosion Science 2026

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Authors: Guoqian Mu, Dongping Gao, Wenqing Qu, Xiaohong Li, Yanhua Zhang, Hongshou Zhuang

DOI: 10.1016/j.corsci.2026.113605

Cited by: 1

References: 65

Fields of Study & Subjects

Advanced Welding Techniques Analysis Intermetallics and Advanced Alloy Properties Electronic Packaging and Soldering Technologies

References 65